SMD Package Sizes Guide: 0402, 0603, 0805, SOT, SOIC and QFP
Reference for common SMD/SMT package dimensions, from chip resistors to IC packages, with tips on footprint selection, assembly and hand soldering.
Passive chip packages
Imperial codes such as 0402, 0603, 0805 and 1206 describe length and width in hundredths of an inch. 0603/0805 balance density and manufacturability, while 0402 and smaller require precision pick-and-place and reflow.
Metric equivalents differ (e.g. 0603 imperial ≈ 1608 metric), so always confirm the package system on the datasheet and PCB footprint.
Active IC packages
Discrete transistors and diodes commonly use SOT-23, SOT-223 and DPAK. ICs range from SOIC/TSSOP (gull-wing, hand-solderable) to QFN (thermal pad, no leads) and fine-pitch QFP/BGA.
Match land pattern to IPC recommendations, control paste stencil aperture for QFN thermal pads, and verify courtyard spacing for assembly and rework.
Frequently Asked Questions
What is the easiest SMD size to hand-solder?
For passives, 0805/1206; for ICs, SOIC with 1.27mm pitch is the most beginner-friendly.
Are imperial and metric 0603 the same?
No — imperial 0603 is 1.6×0.8mm while metric 0603 is 0.6×0.3mm. Always confirm the standard used.